| Hybrid micro-electronic assembly: |
- Die attach
- Substrate attach
|
| Wire bonding: |
- Automatic wedge bonding
- Thermal-compression and thermosonic wedge bonding
- Ball bonding
- Ribbon bonding
|
| PCB assembly: |
- Surface mount
- Through-hole mount
- Wiring
|
| RF and microwave test to 40GHz: |
- Network Analysis
- Scalar Analysis
- Spectrum Analysis
- Phase Noise
- Time Domain
- Noise Figure
- Fully automated test routines
|
| Product design and development: |
- Mechanical Design
- Electrical Design
- Circuit Board Design
- Circuit Analysis
- Circuit Synthesis
- Reliability Prediction
- Thermal Analysis
- Stress Analysis
|